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＊ Company Type：	OEM ODM Factory Semiconductor Manufacturer (Sales) Component or sub-assembly Contract package or manufacturer Medical Supplies/Equipment Suppliers Communications, Automotive Industry Suppliers Consumer Electronics Supplier Test Equipment, ICs, Hybrid Circuits Industrial Control System or Equipment Manufacturer Material/Chemistry/Hardware Manufacturing Sales Independent R&D Lab Educational Institution Consultant Resellers Government and military units Other related fields - please specify as:

＊ Company Properties：	LED Package Lighting and Light Sources and LED Drivers Touch Panel Monitor Power Supply Semiconductor Package IGBT Industrial Products Computer Communication equipment Consumer Electronics Appliances Motor Assembly Inverter/Inverter Assembly Traditional Automotive Electronics New energy vehicle battery assembly Smart Meter Solar Railway Motor Wind Motor Medical Devices Military Aerospace Other - Please specify product as:

＊ Company Products：

Application method：	Next/caulk Semiconductor Package Potting Apply Protection Heat conduction Optics Applications Electromagnetic shield Other - please specify for:

Requirements：	RoHS UL94V-0 UL94V-1 UL94HB Halogen Free FDA MIL Other:

Curing method：	Room temperature Heating UV (ultraviolet light curing) Anaerobic Other:

CURING TIME：	1 Min. 10 Min. 1 Hr 8 Hr 12 Hr 24 Hr Other:

Curing temperature：	25°C 60°C 80°C 100°C 120°C 150°C 180°C Other:

Temperature Range：	℃～ ℃

Material color：	Transparent Translucent Black white Grey Other:

＊ Detailed application requirements：

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